April 18 2024
COIN-3D: collaborative innovation in 3D VLSI reliability
COIN-3D focuses on fostering strategic networking and knowledge exchange among leading European research institutions to enhance research management and commercialization capacities in the area of 2.5/3D chiplet architectures. Coordinated by the University of Thessaly in Greece, the project includes four partners across the EU.
The University of Amsterdam plays a crucial role within this project, with a specific budget of €249,631 out of the total project budget of €1,436,881. This initiative will contribute not only to the advancement of 3D VLSI reliability but also to strengthening international collaborations and sharing critical technological insights.
Vergelijkbaar >
Similar news items
![CuspAI Introduces Itself at LAB42](/Cusp_ai.jpg?version=4136)
6 September 2024
CuspAI Introduces Itself at LAB42
read more >
![Advanced AI for Surveillance Robots: A Collaborative Project by Dutch Institutions](/cees_nieuw_loab.jpg?version=4132)
5 September 2024
Advanced AI for Surveillance Robots: A Collaborative Project by Dutch Institutions
read more >
![NeuroAI: Charlotte Frenkel explores the future of AI inspired by the human brain](/AINED.jpg?version=852)
September 5, 2024
NeuroAI: Charlotte Frenkel explores the future of AI inspired by the human brain
read more >