COIN-3D: collaborative innovation in 3D VLSI reliability

COIN-3D focuses on fostering strategic networking and knowledge exchange among leading European research institutions to enhance research management and commercialization capacities in the area of 2.5/3D chiplet architectures. Coordinated by the University of Thessaly in Greece, the project includes four partners across the EU.

The University of Amsterdam plays a crucial role within this project, with a specific budget of €249,631 out of the total project budget of €1,436,881. This initiative will contribute not only to the advancement of 3D VLSI reliability but also to strengthening international collaborations and sharing critical technological insights.